Wacker P12 thermal paste, 20 ml

WACKER^® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to apply a thin coating of WACKER^® PASTE P 12. In the assembly of semiconductors, e. g. diodes, transistors and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. When assembled, a firm metal-to-metal contact might be hampered by these surface irregularities. A significant percentage of the device's surface therefore might lack direct contact to the heatsink. Remaining gaps are filled with air, providing relatively poor thermal conductivity.